Project 01 / 03 · 2024 — Present

Minerva
platform.

A reusable, low-cost high-altitude platform for testing CubeSat payloads before orbital launch. I lead the mechanical team across the ground segment, payload shell, integration, and flight campaigns.

Minerva second flight campaign
Second high-altitude campaignMechanical team lead
80 gcurrent shell mass
35 kmdesign altitude
1U → 3Uscalable architecture
10person mechanical team

Design for the field, then learn from the flight.

Minerva makes it possible to test payload concepts in a high-altitude environment before committing to orbit. That means the designs have to be lightweight, accessible, repeatable, and practical for a student team to build and integrate.

Minerva team after a launch
Minerva team

From enclosure concept to a mission-tested system.

I designed the Ground Station Receiving Unit around the real field workflow: antennas, radios, sensors, controls, and electronics needed to stay protected without becoming difficult to access. The enclosure moved through CAD, printed prototypes, hardware integration, and test.

Closed-box render of the Ground Station Receiving Unit
Closed-box render
Ground Station Receiving Unit hardware prototype
Hardware prototype
3D printed model of the Ground Station Receiving Unit
Printed model
Top view of the Ground Station Receiving Unit
Top view / GSRU

One architecture, multiple payload sizes.

The shell evolved from a first prototype into a lighter, scalable structure. The current direction replaces bulky walls with struts and supports a path from 1U to 3U configurations while keeping the payload accessible for integration.

Minerva payload shell version one
V1 / first shell
Minerva payload shell version two
V2 / revised shell
Exploded view of Minerva payload shell version three
V3 / exploded view
Assembly of Minerva payload shell version three
V3 / assembly

Analysis before flight.

I performed preliminary thermal and static structural simulations for a 2 kg payload at 35 km, including a −36.1°C ambient condition and 23.4 N upward lift loading at the attachment points. The models helped identify where the design needed more margin before hardware testing.

Minerva thermal analysis
Thermal analysis
Minerva von Mises stress analysis
Von Mises stress
Minerva displacement analysis
Displacement
Minerva electronics thermal analysis
Electronics thermal model